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YHJ2M77120 high precision vertical double-sided grinder

YHJ2M77120 high-precision vertical double-sided grinding machine is a double-sided thinning machine tool independently developed and designed by Yuhuan precision. The machine tool can be widely used in silicon carbide, silicon, quartz crystal, sapphire and other non-metallic hard brittle materials made of thin sheet parts, as well as valve plate, valve plate, cylinder piston ring, oil pump blades and other metal parts of the double-sided thinning grinding.


Keywords

Precision grinding, intelligent manufacturing technology, integrated solutions



Typical Machining Parts

Typical Machining Parts

Silicon Carbide quartz stone crystal Sapphire

 

Equipment Highlights


Equipment Highlights

1, the lower disc axial use of static pressure turntable bearing structure, with high precision, high rigidity characteristics, for large pressure loading grinding processing, with good accuracy retention.

2. The inner and outer gear rings of the lower plate are independently driven by servo motors, with a wide range of process adjustment, and the process parameters can be flexibly adjusted according to different material products.

3. The upper plate adopts the floating cylinder mechanism to adjust the balance, and the four groups of floating cylinders are arranged symmetrically and evenly, so as to improve the processing efficiency on the premise of maintaining the processing accuracy.

4. The upper and lower discs have independent cooling water channels to cool the grinding disc. The upper and lower discs are equipped with multi-point temperature sensors (with wireless sensing). Through real-time temperature monitoring, the cooling capacity is controlled and adjusted to ensure the uniform temperature of the grinding disc. And constant.

5, the configuration of online detection system (optional), to achieve simultaneous processing and detection, processing high pass rate.

Technical parameters

Technical parameters

Project

Parameters

Single wafer substrate thickness difference TTV(μm)

≤1.5

Thickness difference between wafer substrate and substrate (μm)

≤3

Minimum thickness of wafer substrate (μm)

350

Flatness of wafer substrate (μm)

≤1.5

Roughness of wafer substrate after chemical polishing (nm)

≤ Ra8

Flatness of upper and lower discs (mm)

≤ 0.005

Maximum loading pressure of upper plate (t)

1.5

Maximum stroke of upper plate (mm)

350

Size of upper polishing disc (mm)

Φ1120*Φ385*50

Lower disc runout (mm)

≤0.01

Size of lower polishing disc (mm)

Φ1120*Φ385*50

Lifting height of outer gear ring (mm)

24~28

 

Project

Parameters

Maximum load of lower disc hydrostatic bearing (t)

7

Upper disc speed (RPM)

5~60

Lower disc speed (RPM)

5~60

Upper plate motor power (KW)

18.5

Lower plate motor power (KW)

18.5

Sun speed (RPM)

5~100

Sun gear motor power (KW)

4.4

Outer ring gear speed (RPM)

1~10

Power of outer ring gear motor (KW)

4.4

Number of Star Wheels (unit)

5

Wafer Processing Specifications (inch)

≤ 8 "(for proofing) 6" (commonly used)

Equipment weight (t)

9

 

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Keywords: CNC grinding machine series, grinding and polishing machine series, intelligent equipment, metallurgical energy equipment
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