Yuhuan CNC Machine Tool Co., Ltd.

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YHMG7430 High Precision Vertical Single Surface Grinding Machine

This machine is mainly used for precision thinning of hard and brittle materials such as sapphire,silicon wafers,germanium wafers,silicon carbide,gallium nitride,gallium arsenide,silicon nitride,and ceramics.It is a precision thinning equipment suitable for 4 to 12inch specifications.

Keywords

Precision grinding, intelligent manufacturing technology, integrated solutions

Classification

CNC grinding machine series

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Typical Machining Parts

Equipment Highlights

MAIN FEATURES
1.The grinding wheel adopts the 12-inch national standard diamond grinding wheel.The selection of the grinding wheel particle size is customized according to the customers process requirements;the thinning unit adopts the axial feed(In-Feed) grinding principle,which is compatible with 300~50mm wafer grinding and thinning processing.

2.The Machine has functions such as multi-stage grinding program and overload waiting to meet various process requirements.

3.The grinding wheel spindle adopts a high-precision air-floating special electric

spindle,which is controlled by the CNC system through the frequency converter for speed regulation,and the process speed can be determined according to different products.

4.In order to achieve high-precision and high-quality processing,it is equipped with a high-rigidity,low-vibration,and low-thermal expansion air-floating spindle.The spindle of the work bench is also equipped with high-rigidity,low-vibration,and low-thermal expansion air bearing components.

5.High-precision screw and guide rail components are used,and the driving method is driven by a servo full closed-bop control system.

PERFORMANCE

ITEM		YHMG7430
Workpieces	Diameter Range of Workpieces(mm)	φ50~φ300
Workpieces	Thickness Range of Workpieces(mm)	0.15~50
Axis Parameters	Z-axis effective travel(mm)	100
	Z-axis min motion resolution(mm)	0.0001
	Z-axis fast forward speed(mm/s)	10
	Z-axis grinding feed rate(μm/s)	0.1～80
Grinding head parameters	Grinding head rotation speed(Rpm)	50~2000 Stepless speed regulation
	Diameter of Grinding Wheel(mm)	φ313
	Grinding wheel spindle power(Kw)	11Kw
Overall machine parameters	Total Power(Kw)	25Kw
	Machine Weight(Kg)	3500
	Machine Size(mm)	1850×1500×2200